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1. general description the uhf epcglobal generation 2 standard allows the commercialized provision of mass adoption of uhf rfid techno logy for passive smart tags and labels. main fields of applications are supply chain management and logistics for worldwide use with special consideration of european, us and chinese frequencies to ensure that operating distances of several me ters can be realized. the g2x is a dedicated chip for passive, intelligent t ags and labels supporting the epcglobal class 1 generation 2 uhf rfid standard. it is especially suited for applications where operating distances of several meters and high anti-collision rates are required. the g2x is a product out of the nxp semico nductors ucode product family. the entire ucode product family offers anti-collision and collision arbitratio n functionality. this allows a reader to simultaneously operate mult iple labels / tags within its antenna field. a ucode g2x based label/ tag requires no external power supply. its contact-less interface generates the power supply via the antenna circuit by propagative energy transmission from the interr ogator (reader), while the system clock is generated by an on-chip oscillator. data transmitted from interrog ator to label/tag is demodulated by the interface, and it also modulates the interrogator?s electromagnetic field for data transmission from label/tag to interrogator. a label/tag can be operated without the need for line of sight or battery, as long as it is connected to a dedicated antenna for the targeted frequency range. when the label/tag is within the interrogator?s operating range, the high-speed wireless interface allows data transmission in both directions. in addition to the epc specifications the g2 x offers an in tegrated eas (electronic article surveillance) feature and read protection of the memory content. on top of the specification of the g2xl the g2xm offers 512-bit of user memory. sl3ics1002/1202 ucode g2xm and g2xl rev. 3.6 ? 10 march 2011 139036 product data sheet company public
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 2 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 2. features and benefits 2.1 key features ? 512-bit user memory (g2xm only) ? 240-bit of epc memory ? 64-bit tag identifier (tid) including 32-bit unique serial number ? memory read protection ? eas (electronic article surveillance) command ? calibrate command ? 32-bit kill password to permanently disable the tag ? 32-bit access password to allow a transiti on into the secured transmission state ? broad international operating frequency: from 840 mhz to 960 mhz ? long read/write ranges due to extremely low power design ? reliable operation of multiple ta gs due to advanced anti-collision ? forward link: 40-160 kbit/s ? return link: 40-640 kbit/s 2.2 key benefits ? high sensitivity provides long read range ? low q-factor for consistent performance on different materials ? improved interference suppression for reliable operation in multi-reader environment ? large input capacitance for ease of assembly and high assembly yield ? highly advanced anti-co llision resulting in highest identification speed ? reliable and robust rfid technology suitable for dense reader and noisy environments 2.3 custom commands ? eas alarm enables the uhf rfid tag to be used as eas tag without the need for a backend data base. ? read protect protects all memory content including crc16 from unauthorized reading. ? calibrate activates permanent back-scatter in order to evaluate the tag-to-reader performance.
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 3 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 3. applications ? supply chain management ? item level tagging ? asset management ? container identification ? pallet and case tracking ? product authentication 4. ordering information [1] fcs2 polymer strap, jedec outline standard copper [2] fcs2 polymer strap, jedec outline standard aluminum table 1. ordering information g2xm type number package name description version SL3ICS1002FUG/v7af wafer bumped die on sawn wafer - sl3s1002ftt tssop8 plastic thin shrink small outline package; 8 leads; body width 3 mm sot505-1 sl3s1002ftb1 xson3 plastic extremely thin small outline package;3 terminals; body 1 x 1.45 x 0,5 mm sot1122 sl3s1002ac0 fcs2 plastic flip chip strap package; 2 leads, 9 mm wide tape [1] sot1040-1 sl3s1002ac2 fcs2 plastic flip chip strap package; 2 leads; 9 mm wide tape [2] sot1040-1 table 2. ordering information g2xl type number package name description version sl3ics1202fug/v7af wafer bumped die on sawn wafer - sl3s1202ftt tssop8 plastic thin shrink small outline package; 8 leads; body width 3 mm sot505-1 sl3s1202ftb1 xson3 plastic extremely thin small outline package;3 terminals; body 1 x 1.45 x 0,5 mm sot1122 sl3s1202ac0 fcs2 plastic flip chip strap package; 2 leads, 9 mm wide tape [1] sot1040-1 sl3s1202ac2 fcs2 plastic flip chip strap package; 2 leads; 9 mm wide tape [2] sot1040-1
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 4 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 5. block diagram the sl3ics1002/1202 ic consists of three major blocks: - analog rf interface - digital controller - eeprom the analog part provides stable supply voltage and demodulates data received from the reader for being processed by the digital pa rt. further, the modulation transistor of the analog part transmits data back to the reader. the digital section includes the state mach ines, processes the protocol and handles communication with the eeprom, which co ntains the epc and the user data. fig 1. block diagram of g2x ic 001aai335 mod demod vreg vdd data in data out r/w analog rf interface pa d pa d rect digital control antenna anticollision read/write control access control eeprom interface control rf interface control eeprom memory sequencer charge pump
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 5 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 6. wafer layout and pinning information 6.1 wafer layout (1) x-scribe line width: 56.4 m (2) y-scribe line width: 56.4 m (3) chip step, x-length: 488.0 m (4) chip step, y-length: 470,0 m (5) bump to bump distance x (tp1 - rfn): 351,0 m (6) bump to bump distance y (rfn - rfp): 333,0 m (7) distance bump to metal sealring x: 40,3 m (8) distance bump to metal sealring y: 40,3 m bump size x x y: 60 m x 60 m fig 2. wafer layout and pinning information 001aai346 not to scale! (1) (7) (2) (8) (5) (6) (4) (3) y x tp2 tp1 rfn rfp
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 6 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 6.2 fcs2 layout strap and pinning fig 3. pinning - sot1040-1 table 3. pin description of sot1040-1 symbol pin description la antenna connection 1 lb antenna connection 2
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 7 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 7. package outline fig 4. package tssop8, sot505-1 table 4. pin description of tssop8 symbol pin description rfn 1 grounded antenna connector - 2 to 7 not used rfp 8 ungrouded antenna connector unit a1 a max. a2 a3 bp l he lp wy v ce d (1) e (2) z (1) references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.45 0.25 0.28 0.15 3.1 2.9 3.1 2.9 0.65 5.1 4.7 0.70 0.35 6 0 0.1 0.1 0.1 0.94 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.7 0.4 sot505-1 99-04-09 03-02-18 w m bp d z e 0.25 14 8 5 a a 2 a 1 lp (a3) detail x l he e c v m a x a y 2.5 5 mm 0 scale t sso p8: plastic thin shrink small outline package; 8 leads; body width 3 mm sot505-1 1.1 pin 1 index
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 8 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl table 5. tssop8 marking type type code (marking) comment sl3s1202ftt sl3xl ucode g2xl sl3s1002ftt sl3xm ucode g2xm
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 9 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl fig 5. package outline sot1122 references outline version european projection issue date iec jedec jeita sot1122 mo-252 sot1122_po unit mm max nom min 0.50 0.04 0.55 0.425 0.30 0.25 0.22 0.35 0.30 0.27 a (1) dimensions notes 1. dimension a is including plating thickness. 2. can be visible in some manufacturing processes. sot1122 a 1 d 1.50 1.45 1.40 1.05 1.00 0.95 eee 1 0.55 0.50 0.47 0.45 0.40 0.37 bb 1 ll 1 09-10-09 xson3: plastic extremely thin small outline package; no leads; 3 terminals; body 1 x 1.45 x 0.5 mm d e e 1 e a 1 b 1 l 1 l e 1 0 1 2 mm scale 3 1 2 b 4 (2) 4 (2) a pin 1 indication type code terminal 1 index area
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 10 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl table 6. pin description of sot1122 symbol pin description rfp 1 ungrouded antenna connector rfn 2 grounded antenna connector n.c. 3 not connected table 7. sot1122 marking type type code (marking) comment sl3s1202ftb1 ul ucode g2xl sl3s1002ftb1 um ucode g2xm
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 11 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl fig 6. package fcs2, sot1040aa1, 12 m cu metallization
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 12 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl fig 7. package fcs2, sot1040ab2, 20 m al metallization
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 13 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl fig 8. splicing drawing sot1040-1
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 14 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 8. mechanical specification 8.1 wafer specification see ref. 20 ? data sheet - delivery type description ? gener al specification for 8? wafer on uv-tape with electronic fail die marking, bl-id document number: 1093** ? . 8.1.1 wafer ? designation: each wafer is scribed with batch number and wafer number ? diameter: 200 mm (8?) ? thickness: 150 m 15 m ? number of pads 4 ? pad location: non diagonal/ placed in chip corners ? distance pad to pad rfn-rfp 333.0 m ? distance pad to pad tp1-rfn: 351.0 m ? process: cmos 0.14 m ? batch size: 25 wafers ? dies per wafer: 120.000 8.1.2 wafer backside ? material: si ? treatment: ground and stress release ? roughness: r a max. 0.5 m, r t max. 5 m 8.1.3 chip dimensions ? die size without scribe: 0.414 mm x 0.432 mm = 0.178 mm 2 ? scribe line width: x-dimension:56.4 m (width is measured on top metal layer) y-dimension: 56.4 m (width is measured on top metal layer) 8.1.4 passivation on front ? type sandwich structure ? material: pe-nitride (on top) ? thickness: 1.75 m total thickness of passivation
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 15 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 8.1.5 au bump ? bump material: > 99.9% pure au ? bump hardness: 35 ? 80 hv 0.005 ? bump shear strength: > 70 mpa ? bump height: 18 m ? bump height uniformity: ? within a die: 2 m ? within a wafer: 3 m ? wafer to wafer: 4 m ? bump flatness: 1.5 m ? bump size: ? rfp, rfn 60 x 60 m ? tp1, tp2 60 x 60 m ? bump size variation: 5 m ? under bump metallizat ion: sputtered tiw 8.1.6 fail die identification no inkdots are applied to the wafer. electronic wafer mapping (secs ii format) covers the electrical test results and additionally the results of mechanical/visual inspection. see ref. 20 ? data sheet - delivery type description ? gener al specification for 8? wafer on uv-tape with electronic fail die marking, bl-id document number: 1093** ? 8.1.7 map file distribution see ref. 20 ? data sheet - delivery type description ? gener al specification for 8? wafer on uv-tape with electronic fail die marking, bl-id document number: 1093** ?
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 16 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 8.2 sot1040 specification table 8. mechanical properties sot1040aa1 package name outline code lead frame format package size antenna bond pad size sot1040 sot1040aa1 single row length: 9 mm 3,0 x 3,0 mm product pitch: 4 mm width: 4 mm metallization: 12 m cu substrate: 38 m pet thickness: max. 250 m table 9. mechanical properties sot1040ab2 package name outline code lead frame format package size antenna bond pad size sot1040 sot1040ab2 single row length: 9 mm 3,0 x 3,0 mm product pitch: 4 mm width: 4 mm metallization: 20 m al substrate: 38 m pet thickness: max. 250 m
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 17 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 9. limiting values [1] stresses above those listed under absolute maxi mum ratings may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any conditions other than those described in the operating conditions and electrical characterist ics section of this specification is not implied. [2] this product includes circuitry spec ifically designed for the protection of its internal devices from the damaging effects of excessive static charge. nonetheless, it is suggest ed that conventional precautions be taken to avoid applying greater than the rated maxima. [3] for esd measurement, the die chip has been mounted into a cdip20 package. [4] see also section 11.1 ? storage conditions ? [5] see also section 11.2 ? assembly conditions ? table 10. limiting values [1] [2] in accordance with the absolute maximum rating system (iec 60134) voltages are referenced to rfn symbol parameter conditions min max unit die t stg storage temperature range -55 +125 c t oper operating temperature -40 +85 c v esd electrostatic discharge voltage human body model [3] - 2kv tssop8, sot1122 t stg storage temperature range -55 +125 c p tot total power dissipation - 30 mw t oper operating temperature -40 +85 c v esd electrostatic discharge voltage human body model - 2kv sot1040aa1, sot1040ab2 t oper operating temperature [3] [5] -40 +70 c r.h. stg relative humidity - 60 % t stg storage temperature range [4] +15 +30 c v esd electrostatic discharge voltage human body model - 2kv antenna bonding [5] label converting [5]
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 18 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 10. characteristics 10.1 wafer characteristics [1] power to process a query command [2] measured with a 50 source impedance [3] at minimum operating power [4] values measured for a 40 khz phase re serval command under matched conditions 10.2 package characteristics [1] measured with network analyzer at 915 mhz; values at 0.5 dbm after peak max of on-set of die, measured in the center of the pads. table 11. wafer characteristics symbol parameter conditions min typ max unit memory characteristics t ret eeprom data retention t amb 55 c50--year n we eeprom write endurance t amb 55 c 100000 - - cycle interface characteristics p tot total power dissipation - 30 mw f oper operating frequency 840 - 960 mhz p min minimum operating power supply [1] [2] --15 -dbm c i input capacitance (parallel) [3] - 0.88 - pf q quality factor (im (z chip ) / re (z chip) ) [3] -9 -- z impedance (915 mhz) - 22 - j195 - - modulated jammer suppression 1.0 mhz [4] -- 4 -db - unmodulated jammer suppression 1.0 mhz [4] -- 4 -db table 12. package interface characteristics symbol parameter conditions min typ max unit interface characteristics sot 1040aa1 (cu strap) c i input capacitance [1] -1.36 -pf z sot1040aa1 impedance (915 mhz) [1] - 14.8-j128 - interface characteristics sot 1040ab2 (al strap) c i input capacitance [1] -1.42 -pf z sot1040ab2 impedance (915 mhz) [1] - 13.3-j122 - interface characteristics sot1122 c i input capacitance (parallel) [1] - 1.02 - pf z sot1122 impedance (915 mhz) - 18.6 - j171.2 - interface characteristics tssop8 c i input capacitance (parallel) [1] - 1.16 - pf z tssop8 impedance (915 mhz) - 16 - j148 -
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 19 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 11. handling information for flip chip strap (fcs2, sot1040) 11.1 storage conditions the following storage conditions are applicable if the fcs2 products are kept in their original packing: ? storage temperature: +15 c to +30 c ? relative humidity: max. 60 % ? duration of storage: max. 0.5 years deviating requirements have to be arranged with nxp semiconductors. 11.2 assembly conditions 11.2.1 general assembly recommendations nxp recommends to use dedicated strap asse mbly equipment to prevent damage of the fcs2 strap or the die itself. in case of any doubts, the customer is co nstrained to contact nxp semiconductors for further clarification. 11.2.2 antenna bonding mounting the fcs2 product onto the antenna can be done in multiple ways: ? crimping ? conductive gluing ? soldering (possible, but not recommended by nxp semiconductors) 11.2.3 label converting generally, an optimization of the entire lamination process by label manufacturer is recommended in order to minimize the stress onto the module and guarantee high assembly yield. roller diameter must not be smaller than 45 mm.
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 20 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 12. packing information 12.1 flip chip strap (fcs2, sot1040) the strap is shipped on a 13 inch by 9 mm reel. for details please refer to ref. 21 ? data sheet - flip chip strap - fcs2, general packing specification, bl-id document number: 1738** ? . 12.2 wafer see ref. 20 ? data sheet - delivery type description ? gener al specification for 8? wafer on uv-tape with electronic fail die marking, bl-id document number: 1093** ? . 12.3 tssop see http://www.standardics.nxp.com/pa ckaging/packing/pdf/sot505-2.t4.pdf . 12.4 sot1122 part orientation t1. for details please refer to http://www.standardics.nxp.com/pack aging/packing/pdf/sot886.t1.t4.pdf .
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 21 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 13. functional description 13.1 power transfer the interrogator provides an rf field that powers the tag, equipped with a ucode g2x. the antenna transforms the impedance of free space to the chip input impedance in order to get the maximum possible power for the g2x on the tag. the rf field, which is oscillating on the opera ting frequency provided by the interrogator, is rectified to provide a smoo thed dc voltage to the analog and digital modules of the ic. the antenna that is attached to the chip may use a dc connection between the two antenna pads. therefore the g2x also enables loop antenna design. possible examples of supported antenna structures can be fo und in the reference antenna design guide. 13.2 data transfer 13.2.1 reader to g2x link an interrogator transmit s information to the ucode g2x by modulating an rf signal in the 840 mhz - 960 mhz frequency range. the g2x receives both information and operating energy from this rf signal. tags ar e passive, meaning that they receive all of their operating energy from the interrogator's rf waveform. an interrogator is using a fixed modulation and data rate for the duration of at least an inventory round. it communicates to the g2x by modulating an rf carrier using dsb-ask, ssb-ask or pr-ask with pie encoding. for further details refer to section 18 , ref. 1 , section 6.3.1.2. inte rrogator-to-tag (r=>t) communications. 13.2.2 g2x to reader link an interrogator receives information from the ucode g2x by transmitting a continuous-wave rf signal to the tag; th e g2x responds by modulating the reflection coefficient of its antenna, thereby generating modulated sidebands used to backscatter an information signal to the interrogator. the sy stem is a reader talks first (rtf) system, meaning that a g2x modulates its antenna reflec tion coefficient with an information signal only after being directed by the interrogator. g2x backscatter is a combination of ask and psk modulation depending on the tuning and bias point. the backscattered data is either modulated with fm 0 baseband or miller sub carrier. for further details refer to section 18 , ref. 1 , section 6.3.1.3. tag- to-interrogator (t=>r) communications.
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 22 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 13.3 operating distances rfid tags based on the ucode g2x silicon may achieve maximum operating distances according the following formula: (1) (2) [1] cept/etsi regulations [cept1], [etsi1]. [2] new cept/etsi regulations. [etsi3]. [3] fcc 47 part 15 regulation [fcc1]. [4] these read distances are maximum values for general tags and labels. practical usable values may be lower due to damping by object materials and environm ental conditions. a special tag antenna design can help achieve higher values. the typical write range is > 50% of the read range. table 13. symbol description symbol description unit p tag minimum required rf power for the tag w g tag gain of the tag antenna - eirp transmitted rf power m wavelength m r max maximum achieved operating distance for a /2-dipole m loss factor assumed to be 0.5 considering matching and package losses - rdistance m table 14. operating distances for ucode g2x based tags and labels in released frequency bands frequency range region available power calculated read distance single antenna [4] unit 868.4 to 868.65 mhz (uhf) europe [1] 0.5 w erp 3.6 m 865.5 to 867.6 mhz (uhf) europe [2] 2 w erp 7.1 m 902 to 928 mhz (uhf) america [3] 4 w eirp 7.5 m p tag eirp g tag 4 r ---------- ?? ?? 2 ?? = r max eirp g tag 2 ?? 4 () 2 p tag --------------------------------------- ? =
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 23 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 13.4 air interface standards the g2x is certified according epcglobal 1.0.9 and fully supports all parts of the "specification for rfid air interface epcglobal, epctm radio-frequency identity protocols, class-1 generation-2 uhf rfid, pr otocol for communications at 860 mhz - 960 mhz, version 1.1.0". epcglobal compliance and in teroperability ce rtification
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 24 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 14. physical layer and signaling 14.1 reader to g2x communication 14.1.1 physical layer for interrogator-to-g2x link modulation refer to section 18 , ref. 1 , annex h.1 baseband waveforms, modulated rf, and detected waveforms. 14.1.2 modulation an interrogator sends information to one or more g2x by modulating an rf carrier using double-sideband amp litude shift keying (dsb-ask), si ngle-sideband am plitude shift keying (ssb-ask) or phase -reversal amplitude shift keying (pr-ask) using a pulse-interval encoding (pie) format. the g2x receives the operating energy from this same modulate d rf carrier. section 18 , ref. 1 : annex h, as well as chapter 6.3.1.2.2. the g2x is capable of demodulating all three modulation types. 14.1.3 data encoding the r=>t link is using pie. for the definition of the therefore relevant reference time interval for interrogator-to-chip signaling (tari) refer to section 18 , ref. 1 , chapter 6.3.1.2.3. the tari is specified as the duration of a data-0. 14.1.4 data rates interrogators shall communicate using tari values between 6.25 s and 25 s, inclusive. for interrogator compliance evaluation the preferred tari values of 6.25 s, 12.5 s or 25 s should be used. for further details refer to section 18 , ref. 1 , chapter 6.3.1.2.4. 14.1.5 rf envelope for r=>t a specification of the relevant rf envelope parameters can be found in section 18 , ref. 1 , chapter 6.3.1.2.5. 14.1.6 interrogator power-up/down waveform for a specification of the interrogator power-up and power-down rf envelope and waveform parameters refer to section 18 , ref. 1 , chapters 6.3.1. 2.6 and 6.3.1.2.7. 14.1.7 preamble and frame-sync an interrogator shall begin all r=>t signaling with either a preamble or a frame-sync. a preamble shall precede a query command and de notes the start of an inventory round. for a definition and explanation of the relev ant r=>t preamble and frame-sync refer to section 18 , ref. 1 , chapter 6.3.1.2.8.
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 25 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 14.2 g2x to reader communication an interrogator receives information from a g2x by transmitting an unmodulated rf carrier and listening for a backscattered re ply. the g2x backscatters by switching the reflection coefficient of its an tenna between two states in a ccordance with the data being sent. for further details refer to section 18 , ref. 1 , chapter 6.3.1.3. 14.2.1 modulation the ucode g2x communicates information by backscatter-modulating the amplitude and/or phase of the rf carrier. interrogator s shall be capable of demodulating either demodulation type. 14.2.2 data encoding the encoding format, selected in response to interrogator commands, is either fm0 baseband or miller-modulate d subaltern. the interrogato r commands the encoding choice 14.2.2.1 fm0 baseband fm0 inverts the baseband phase at every symbol boundary; a data-0 has an additional mid-symbol phase inversion. for details on fm0 and generator state diagram, fm0 symbols and sequences and how fm0 transmissions should be terminated refer to section 18 , ref. 1 , chapter 6.3.1.3. 14.2.2.2 fm0 preamble t=>r fm0 signaling begin with one of two defi ned preambles, depending on the value of the trext bit specified in the query command that initiated the inventory round. for further details refer to section 18 , ref. 1 , chapter 6.3.1.3. 14.2.2.3 miller-modulated sub carrier baseband miller inverts its phase between two data-0s in sequence. baseband miller also places a phase inversion in th e middle of a data-1 symbol. for details on miller-modulated sub carrier, generator state diagram, sub carrier sequences and terminating sub carrier transmissions refer to section 18 , ref. 1 , chapter 6.3.1.3. 14.2.2.4 miller sub carrier preamble t=>r sub carrier signaling begins with one of the two defined preambles. the choice depends on the value of the trext bit specified in the query command that initiated the inventory round. for further details refer to section 18 , ref. 1 , chapter 6.3.1.3. 14.2.3 data rates the g2x ic supports tag to interrogator data rates and link frequencies as specified in section 18 , ref. 1 , chapter 6.3.1.3.
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 26 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 14.3 link timing for the interrogator interacting with a ucode g2x equipped tag population exact link and response timing requirements must be fulfilled, which can be found in section 18 , ref. 1 , chapter 6.3.1.6. 14.3.1 regeneration time the regeneration time is the time required if a g2x is to demodulate the interrogator signal, measured from t he last falling edge of the last bit of the g2x response to the first falling edge of the interrogator tr ansmission. this time is refe rred to as t2 and can vary between 3.0 tpri and 20 tpri. for a more detailed description refer to section 18 , ref. 1 , chapter 6.3.1.6. 14.3.2 start-up time for a detailed description refer to section 18 , ref. 1 , chapter 6.3.1.3.4. 14.3.3 persistence time an interrogator chooses one of four sessions and inventories tags within that session (denoted s0, s1, s2, and s3). the interrogator and associated ucode g2x population operate in one and only one session for t he duration of an inventory round (defined above). for each session, a corresponding inve ntoried flag is maintained. sessions allow tags to keep track of their inventoried stat us separately for each of four possible time-interleaved inventory processes, usin g an independent inventoried flag for each process. two or more interrogators can use sessions to independently inventory a common ucode g2x chip population. a session flag indicates whether a g2x may respond to an interrogator. g2x chips maintain a separate inventoried flag for each of four sessions; each flag has symmetric a and b values. within any given session, interrogators typically inventory tags from a to b followed by a re-inventory of tags from b back to a (or vice versa). additionally, the g2x has implemented a selected flag, sl, which an interrogator may assert or deassert using a select command. for a description of inventoried flags s0 ? s3 refer to section 18 , ref. 1 chapter 6.3.2.2 and for a description of the selected flag refer to section 18 , ref. 1 , chapter 6.3.2.3. for tag flags and respective persistence time refer to section 18 , ref. 1 , table 6.14. 14.4 bit and byte ordering the transmission order for all r=>t and t=>r communications re spects the following conventions: ? within each message, the most-significa nt word is transmitted first, and ? within each word, the most-signific ant bit (msb) is transmitted first, whereas one word is composed of 16 bits. to represent memory addresses and mask lengths ebv-8 values are used. an extensible bit vector (ebv) is a data structure with an extensible data range. for a more detailed explanation refer to section 18 , ref. 1 , annex a.
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 27 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 14.5 data integrity the g2x ignores invalid commands. in general, "invalid" means a command that (1) is incorrect given the current the g2x state, (2) is unsupported by the g2x, (3) has incorrect parameters, (4) has a crc error, (5) specifies an incorrect session, or (6) is in any other way not recognized or not executable by the g2x. the actual definition of "invalid" is state-specific and defined, for each g2x state, in n section 18 , ref. 1 annex b and annex c. all ucode g2x backscatter erro r codes are summarized in section 18 , ref. 1 error codes, annex i. for a detailed description of the individual backscatter error situations which are command specific please refer to the section 18 , ref. 1 individual command description section 6.3.2.10. 14.6 crc a crc-16 is a cyclic-redundancy check that an interrogator uses when protecting certain r=>t commands, and the g2x uses when protecting certain backscattered t=>r sequences. to generate a crc-16 an interrogator or the g2x first gen erates the crc-16 precursor shown in section 18 , ref. 1 table 6.11, then take the ones-complement of the generated prec ursor to form the crc-16. for a de tailed descripti on of the crc-16 generation and handling rules refer to section 18 , ref. 1 , chapter 6.3.2.1. the crc-5 is only used to protect the query command (out of the mandatory command set). it is calculated out of x5 + x3 + 1. for a more detailed crc-5 description refer to section 18 , ref. 1 , table 6.12. for exemplary schematic diagrams for crc-5 and crc-16 encoder/decoder refer to section 18 , ref. 1 , annex f. for a crc calculation example refer to section 16.1 , ta b l e 3 2 and table 33 .
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 28 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 15. tag selection, inventory and access this section contains all information including commands by which a reader selects, inventories, and accesses a g2x population an interrogator manages ucode g2x equip ped tag populations using three basic operations. each of these operations comprises one or more commands. the operations are defined as follows select: the process by which an interrogator selects a tag population for inventory and access. interrogators may use one or more select commands to select a particular tag population prior to inventory. inventory: the process by which an interr ogator identifies ucode g2x equipped tags. an interrogator begins an inventory round by transmitting a query command in one of four sessions. one or more g2x may reply. the interrogator detects a single g2x reply and requests the pc, epc, and crc-16 from the chip. an inventory round operates in one and only one session at a time. for an example of an interrogator inventorying and accessing a single g2x refer to section 18 , ref. 1 , annex e. access: the process by which an interrogator transacts with (reads from or writes to) individual g2x. an individual g2x must be uniquely identifie d prior to access. access comprises multiple commands, some of which employ one-time-pad based cover-coding of the r=>t link.
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 29 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 15.1 g2x memory for the general memory layout according to the standard section 18 , ref. 1 , refer to figure 6.17. the tag memory is logically subdivided into four distinct banks. in accordance to the standard section 18 , ref. 1 , section 6.3.2.1. t he tag memory of the sl3ics1002 g2xm is organized in following 4 memory sections: the logical address of all memory banks begin at zero (00h). table 15. g2x memory sections name size bank reserved memory (32 bit access and 32 bit kill password) 64 bit 00b epc (excluding 16 bit crc-16 and 16 bit pc) 240 bit 01b tid (including unique 32 bit serial number) 64 bit 10b user memory (g2xm only) 512 bit 11b fig 9. g2x tid memory structure class identifier mask-designer identifier model number serial number tid 31 0 11 0 11 07 0 00h 07h 08h 13h 14h 1fh 20h 3fh 6 0 4 0 14h 1fh 18h 19h version number sub version number e2h 006h 00000001h to ffffffffh whenever the 32 bit serial is exceeded the sub version is incremented by 1 3fh 00h addresses addresses addresses bits bits ls byte lsbit lsbit msbit msbit ms byte lsbit lsbit msbit msbit 00000b 0000010b sub version nr version (silicon) nr model nr. mask id ucode epc g2xm 00000b 0000011b 003h 006h ucode epc g2xl 00000b 0000100b 004h 006h 002h
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 30 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 15.1.1 memory map [1] this is the initial memory cont ent when delivered by nxp semiconductors [2] g2xl: hex 3005 fb63 ac1f 3841 ec88 0467 g2xm: hex 3005 fb63 ac1f 3681 ec88 0468 [3] only g2xm table 16. memory map bank address memory address type content initial [1] remark bank 00 00h ? 1fh reserved kill password: refer to section 18 , ref. 1 , chapter 6.3.2.1.1 all 00h unlocked memory 20h ? 3fh reserved access password: refer to section 18 , ref. 1 , chapter 6.3.2.1.1 all 00h unlocked memory bank 01 00h ? 0fh epc crc-16: refer to section 18 , ref. 1 , chapter 6.3.2.1.2 memory mapped calculated crc 10h ? 14h epc backscatter length: refer to section 18 , ref. 1 , chapter 6.3.2.1.2 00110b unlocked memory 15h epc reserved for future use: refer to section 18 , ref. 1 , chapter 6.3.2.1.2 0b unlocked memory 16h epc reserved for future use: refer to section 18 , ref. 1 , chapter 6.3.2.1.2 0b hardwired to 0 17h ?1fh epc numbering system indicator: refer to section 18 , ref. 1 , chapter 6.3.2.1.2 00h unlocked memory 20h - 10fh epc epc: refer to section 18 , ref. 1 , chapter 6.3.2.1.2 [2] unlocked memory bank 10 00h ? 07h tid allocation class identifier: refer to section 18 , ref. 1 , chapter 6.3.2.1.3 1110 0010b locked memory 08h ? 13h tid tag mask designer identifier: refer to section 18 , ref. 1 , chapter 6.3.2.1.3 0000 0000 0110b locked memory 14h ? 1fh tid tag model number: refer to section 18 , ref. 1 , chapter 6.3.2.1.3 tmnr locked memory 20h ? 3fh tid serial number: refer to [ section 18 , ref. 1 , chapter 6.3.2.1.3 snr locked memory bank 11 [3] 00h ? 1ffh user user memory: refer to [ section 18 , ref. 1 , chapter 6.3.2.1.4 undefined unlocked memory
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 31 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 15.1.1.1 user memory (only g2xm) the user memory bank contains a sequential block of 512 bits (32 words of 16 bit) ranging from address 00h to 1fh. the user memory can be accessed via select, read or write command and it may be write locked , permanently write locked, unlocked or permanently unlocked. in addition reading of not only of the user memory but of the whole memory including epc and tid can be protected by usin g the custom readprotect command. 15.1.1.2 special behavior of user memory address 1fh write or select of user memory address 1f h will falsely set an error flag. this will affect the subsequent read or select. the following commands will falsely set an internal error flag (without actually causing an error): 1) write to user memory with wordptr=1fh 2) select to user memory with compare mask ending at bitaddress 1ffh (e.g. pointer=1feh, length=1 or pointe r=1fdh, length=2 ?) note: the error flag is set independent of the chip state (also chips in the e.g. ready state are affected). the falsely set error flag will affect the following sub sequential commands: a) read command with wordcount=0 falsely responds with "memory overrun" error b) select command with length<>0 falsely assumes non existing memory location the behavior can be avoided with: ? turning off the rf carrier to reset the chip (this is wh at readers typically do!). ? using the read command with wordcount<>0. ? sending other command prior to read or select (e.g. write to address<>1fh, reqrn) or executing read or select two times. remark: the write operation itself is not affected by this problem i. e. data is written properly! with commercially available readers this behavior is typically not observed. 15.1.1.3 supported epc types the epc types are defined in the epc tag standards document from epcglobal. these standards define completely that port ion of epc tag data that is standardized, including how that data is encoded on the epc tag itself (i.e. the epc tag encodings), as well as how it is encoded for use in the in formation systems layers of the epc systems network (i.e. the epc uri or uniform resource identifier encodings). the epc tag encodings include a header field followed by one or more value fields. the header field indicates the length of the val ues fields and contains a numbering system identifier (nsi). the value fields contain a un ique epc identifier and optional filter value when the latter is judged to be important to encode on the tag itself.
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 32 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 15.2 sessions, selected and inventoried flags session, selected and inventory flags are according the epcglobal standard. for a description refer to section 18 , ref. 1 , section 6.3.2.3. 15.2.1 g2x states and slot counter for a description refer to section 18 , ref. 1 , section 6.3.2.4. 15.2.2 g2x state diagram the tag state are according the epcglobal standard please refer to: section 18 , ref. 1 , section 6.3.2.4 tag states and slot counter. a detailed tag state diagram is shown in section 18 , ref. 1 , figure 6.19. refer also to section 18 , ref. 1 , annex b for the associated state-transition tables and to section 18 , ref. 1 , annex c for the associated command-response tables. 15.3 managing tag populations for a detailed description on how to manage an ucode g2x tag populations refer to section 18 , ref. 1 , chapter 6.3.2.6. 15.4 selecting tag populations for a detailed description of the ucode g2x tag population selection process refer to section 18 , ref. 1 , section 6.3.2.7. 15.5 inventorying tag populations for a detailed description on accessing individual tags based on the ucode g2x refer to section 18 , ref. 1 , section 6.3.2.8. 15.6 accessing individual tags for a detailed description on accessing individual tags based on the ucode g2x refer to section 18 , ref. 1 , section 6.3.2.9. an example inventory and access of a single ucode g2x tag is shown in section 18 , ref. 1 , annex e.1. 15.7 interrogator commands and tag replies for a detailed description refer to section 18 , ref. 1 , section 6.3.2.10. 15.7.1 commands an overview of interrogator to tag commands is located in section 18 , ref. 1 , table 6.16. note that all mandatory commands are implemented on the g2x according to the standard. additionally the optional command access is supported by the g2x (for details refer to section 15.11 ? optional access command ? ). besides also custom commands are implemented on the g2x (for details refer to section 15.12 ? custom commands ? .
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 33 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 15.7.2 state transition tables the g2x responses to interrogator commands are defined by state annex b transition tables in section 18 , ref. 1 . following states are implemented on the g2x: ? ready, for a description refer to section 18 , ref. 1 , annex b.1. ? arbitrate, for a description refer to section 18 , ref. 1 , annex b.2. ? reply, for a description refer to section 18 , ref. 1 , annex b.3. ? acknowledged, for a description refer to section 18 , ref. 1 , annex b.4. ? open, for a description refer to section 18 , ref. 1 , annex b.5. ? secured, for a description refer to section 18 , ref. 1 , annex b.6. ? killed, for a description refer to section 18 , ref. 1 , annex b.7. 15.7.3 command response tables the g2x responses to interrogator commands are described in following annex c sections of section 18 , ref. 1 : ? power-up, for a description refer to section 18 , ref. 1 , annex c.1. ? query, for a description refer to section 18 , ref. 1 , annex c.2. ? queryrep, for a description refer to section 18 , ref. 1 , annex c.3. ? queryadjust, for a description refer to section 18 , ref. 1 , annex c.4. ? ack, for a description refer to section 18 , ref. 1 , annex c.5. ? nak, for a description refer to section 18 , ref. 1 , annex c.6. ? req_rn, for a description refer to section 18 , ref. 1 , annex c.7. ? select, for a description refer to section 18 , ref. 1 , annex c.8. ? read, for a description refer to section 18 , ref. 1 , annex c.9. ? write, for a description refer to section 18 , ref. 1 , annex c.10. ? kill, for a description refer to section 18 , ref. 1 , annex c.11. ? lock, for a description refer to section 18 , ref. 1 , annex c.12. ? access, for a description refer to section 18 , ref. 1 , annex c.13. ? t2 time-out, for a description refer to section 18 , ref. 1 , annex c.17. ? invalid command, for a description refer to section 18 , ref. 1 , annex c.18. 15.7.4 example data-flow exchange for data flow-exchange examples refer to section 18 , ref. 1 , annex k: ? k.1 overview of the data-flow exchange ? k.2 tag memory contents and lock-field values ? k.3 data-flow exchange and command sequence 15.8 mandatory se lect commands select commands select a particular ucod e g2x tag population based on user-defined criteria.
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 34 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 15.8.1 select for a detailed description of the mandatory select command refer to section 18 , ref. 1 , section 6.3.2.10. 15.9 mandatory inventory commands inventory commands are used to run the collision arbitration protocol. 15.9.1 query for a detailed description of the mandatory query command refer to section 18 , ref. 1 , section 6.3.2.10. 15.9.2 queryadjust for a detailed description of the mandatory queryadjust command refer to section 18 , ref. 1 , section 6.3.2.10. 15.9.3 queryrep for a detailed description of the mandatory queryrep command refer to section 18 , ref. 1 , section 6.3.2.10. 15.9.4 ack for a detailed description of the mandatory ack command refer to section 18 , ref. 1 , section 6.3.2.10. 15.9.5 nak for a detailed description of the mandatory nak command refer to section 18 , ref. 1 , section 6.3.2.10.
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 35 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 15.10 mandatory access commands access commands are used to read or write data from or to the g2x memory. for a detailed description of the mandatory access command refer to section 18 , ref. 1 , section 6.3.2.10. 15.10.1 req_rn access commands are used to read or write data from or to the g2x memory. for a detailed description of the mandatory access command refer to section 18 , ref. 1 , section 6.3.2.10. 15.10.2 read for a detailed description of the ma ndatory req_rn command refer to section 18 , ref. 1 , section 6.3.2.10. 15.10.3 write for a detailed description of the mandatory write command refer to section 18 , ref. 1 , section 6.3.2.10. 15.10.4 kill for a detailed descripti on of the mandatory kill command refer to section 18 , ref. 1 , section 6.3.2.10. 15.10.5 lock for a detailed description of the mandatory lock command refer to section 18 , ref. 1 , section 6.3.2.10. 15.11 optional access command 15.11.1 access for a detailed description of the optional access command refer to section 18 , ref. 1 , section 6.3.2.10.
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 36 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 15.12 custom commands 15.12.1 readprotect the g2x readprotect custom command enables reliable read protection of the entire g2x memory. executing readprotect from the secured state will set the readprotect-bit to '1'. with the readprotect-bit set the g2x will continue to work unaffected but fail its content. following commands will be disabled: read, write, kill, lock, access, readprotect, changeeas, eas alarm and ca librate. the g2x will only reac t upon an anticollision with select, query, queryrep, queryadjust, ack (no truncated reply), nak, reqrn but reply with zeros as epc and crc-16 content (except pc/password). ack will return zeros except for the pc. the read protection can be removed by executing reset readprotect. the readprotect-bit will than be cleared. devices whose access password is zero will ignore the command. a frame-sync must be prepended the command. after sending the readprotect command an interrogator shall transmit cw for the lesser of t reply or 20 ms, where t reply is the time between the interrogator's readprotect command and the backscattered reply. an in terrogator may observe three possible responses after sending a readprotect, depe nding on the success or failure of the operation: ? readprotect succeeds: after completing the readprotect the g2x shall backscatter the reply shown in ta b l e 1 9 comprising a header (a 0-bit), the tag's handle, and a crc-16 calculated over the 0-bit and handle . immediately after this reply the g2x will render itself to this readprotect mode. if the interrogator observes this reply within 20 ms then the readprotect completed successfully. ? the g2x encounters an error: the g2x will backscatter an error co de during the cw period rather than the reply shown in the epcglobal spec (see annex i for error-code definitions and for the reply format). ? readprotect does not succeed: if the inte rrogator does not observe a reply within 20 ms then the readprotect did not complete successfully. the interrogator may issue a req_rn command (containing the handle) to verify that the g2x is still in the interrogation zone, and may re-initiate the readprotect command. the g2x reply to the read protect command will use the ex tended preamble shown in epcglobal spec (figure 6.11 or figure 6.15), as appropriate (i.e. a tag shall reply as if trext=1) regardless of the trext value in the query that initiated the round. table 17. readprotect command command rn crc-16 # of bits 16 16 16 description 11100000 00000001 handle -
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 37 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl table 18. g2x reply to a successful readprotect procedure header rn crc-16 # of bits 1 16 16 description 0 handle - table 19. readprotect command-response table starting state condition response next state ready all ? ready arbitrate, reply, acknowledged all ? arbitrate open all - open secured valid handle & invalid access password ? arbitrate valid handle & valid non zero access password backscatter handle, when done secured invalid handle ? secured killed all ? killed
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 38 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 15.12.2 reset readprotect reset readprotect allows an interrogator to resets the readprotect-bit and re-enables reading of the g2x memory content according the epcglobal specification. the g2x will execute reset readprotect from the open or secured states. if a g2x in the open or secured states rece ives a reset readprotec t with a valid crc-16 and a valid handle but an incorrect access password, it will not reply and transit to the arbitrate state. if a g2x in the open or secured states rece ives a reset readprotec t with a valid crc-16 and a valid handle bu t the readprotect-bit is not set ('0'), it will not change the readprotect-bit but backscatter the reply shown in ta b l e 2 2 . if a g2x in the open or secured receives a reset readprotect with a valid crc-16 but an invalid handle, or it receives a reset readprotect before which the immediately preceding command was not a req_rn, it will ignore t he reset readprotect and remain in its current state. a frame-sync must be prepended the reset readprotect command. after sending a reset readprotect an interrogator shall transmit cw for the lesser of treply or 20 ms, where treply is the time between the interrogator 's reset readprotect command and the g2x backscattered reply. an interrogator may observe three possible responses after sending a reset readprotect, depending on the success or failure of the operation: ? write succeeds: after completing the re set readprotect a g2x will backscatter the reply shown in ta b l e 2 2 comprising a header (a 0-bit), the handle, and a crc-16 calculated over the 0-bit and handle. if th e interrogator observes this reply within 20 ms then the reset readpro tect completed successfully. ? the g2x encounters an error: the g2x will backscatter an error co de during the cw period rather than the reply shown in ta b l e 2 2 (see epcglobal spec for error-code definitions and for the reply format). ? write does not succeed: if the interrogator does not observe a reply within 20 ms then the reset readprotect did no t complete successfully. the interrogator may issue a req_rn command (containing the handle) to verify that the g2x is still in the interrogation zone, and may reissue the reset readprotect command. the g2x reply to the reset readprotect command will use the extended preamble shown in epcglobal spec (figure 6.11 or figure 6.15 ), as appropriate (i.e . a g2x will reply as if trext=1 regardless of the trext value in the query that initiated the round. the reset readprotect command is structured as following: ? 16 bit command ? password: 32 bit access-passwor d xor with 2 times current rn16 ? 16 bit handle ? crc-16 calculate over the first command-code bit to the last handle bit
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 39 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl table 20. reset readprotect command command password rn crc-16 # of bits 16 32 16 16 description 11100000 00000010 (access password) ? 2*rn16 handle - table 21. g2x reply to a successful reset readprotect command header rn crc-16 # of bits 1 16 16 description 0 handle - table 22. reset readprotect command-response table starting state condition response next state ready all ? ready arbitrate, reply, acknowledged all ? arbitrate open readprotect bit is set, valid handle & valid access password backscatter handle, when done open readprotect bit is set, valid handle & invalid access password ? arbitrate readprotect bit is set, invalid handle ? open readprotect bit is reset ? open secured readprotect bit is set, valid handle & valid access password backscatter handle, when done secured readprotect bit is set, valid handle & invalid access password ? arbitrate readprotect bit is set, invalid handle ? secured readprotect bit is reset ? secured killed all ? killed
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 40 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 15.12.3 changeeas a g2x equipped rfid tag can be enhanced by a sta nd-alone operat ing eas alarm feature. with an eas-alarm bi t set to '1' the tag will reply to an eas_alarm command by backscattering a 64 bit alarm code without the need of a se lect or query. the eas is a built-in solution so no connection to a backe nd database is required. as it is a custom command no select or query is required to detect the eas state enabling fast, reliable and offline article surveillance. changeeas can be executed from the secure d state only. the command will be ignored if the access password is zero, the comman d will also be ignored with an invalid crc-16 or an invalid handle, the g2 x will than remain in the cu rrent state. the crc-16 is calculated from the first command-code bit to the last handle bit. a frame-sync must be prepended the command. the g2x reply to a succ essful changeeas will use th e extended pr eamble, as appropriate (i.e. a tag shall reply as if tr ext=1) regardless of the trext value in the query that initiated the round. after sending a changeeas an in terrogator shall transmit cw for less than treply or 20 ms, where treply is the time between the interrog ator's change eas command and the g2x backscattered reply. an interrogator may observe three possible responses after sending a changeeas, depend ing on the success or fa ilure of the operation ? write succeeds: after completing the changeeas a g2x will ba ckscatter the reply shown in ta b l e 2 5 comprising a header (a 0-bit), the handle, and a crc-16 calculated over the 0-bit and handle. if the in terrogator observes this reply within 20 ms then the changeeas completed successfully. ? the g2x encounters an error: the g2x will backscatter an error co de during the cw period rather than the reply shown in ta b l e 2 5 (see epcglobal spec for error-code definitions and for the reply format). ? write does not succeed: if the interrogator does not observe a reply within 20 ms then the changeeas did not complete successfu lly. the interrogator may issue a req_rn command (containin g the handle) to verify that the g2x is still in th e interrogator's field, and may reissu e the change eas command. upon receiving a valid changeeas co mmand a g2x will perf orm the commanded set/reset operation of the eas_alarm-bit. if eas-bit is set, the eas_alarm command will be availa ble after the next power up and reply the 64 bit eas code u pon execution. otherwise the eas_alarm command will be ignored. table 23. changeeas command command changeeas rn crc-16 # of bits 16 1 16 16 description 11100000 00000011 1 ... set eas system bit 0 ... reset eas system bit handle
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 41 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl table 24. g2x reply to a successful changeeas command header rn crc-16 # of bits 1 16 16 description 0 handle - table 25. changeeas command-response table starting state condition response next state ready all ? ready arbitrate, reply, acknowledged all ? arbitrate open all ? open secured valid handle b ackscatter handle, when done secured invalid handle ? secured killed all ? killed starting state condition response next state
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 42 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 15.12.4 eas_alarm eas_alarm is a custom command causing the g2x to immediately backscatter an eas-alarmcode, when eas alarm bit is set without any dela y caused by select, query and without the need for a backend database. the eas feature of th e g2x is available after enab ling it by sending a changeeas command described in section 15.12.3 ? changeeas ? . with an eas-alarm bit set to '1' the g2x will reply to an eas_alar m command by backscat tering a fixed 64 bit alarm code. a g2x will reply to an eas_alarm co mmand from the ready state only. if the eas-alarm bit is reset ('0') by se nding a changeeas command in the password protected secure state the g2x will not reply to an eas_alarm command. the eas_alarm command is structured as following: ? 16 bit command ? 16 bit inverted command ? dr (trcal divide ratio) sets the t=>r link frequency as described in epcglobal spec. 6.3.1.2.8 and table 6.9. ? m (cycles per symbol) sets the t=>r data rate and modulation format as shown in epcglobal spec. table 6.10. ? trext chooses whether the t=>r preamble is prepended with a pilot tone as described in epcglobal spec. 6.3.1.3. a preamble must be prepended the eas_alarm command according epcglobal spec, 6.3.1.2.8. upon receiving an eas_alarm command the tag loads the crc5 register with 01001b and backscatters the 64 bit al arm code accordingly. the re ader is now able to calculate the crc5 over the backscattered 64 bits re ceived to verify the received code. table 26. eas_alarm command command inv_command dr m trext crc-16 # of bits 16 16 1 2 1 16 description 11100000 00000100 00011111 11111011 0: dr=8 1: dr=64/3 00: m=1 01: m=2 10: m=4 11: m=8 0: no pilot tone 1: use pilot tone - table 27. g2x reply to a successful eas_alarm command header eas code # of bits 1 64 description 0 crc5 (msb)
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 43 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl table 28. eas_alarm command-response table starting state condition response next state ready eas-bit is set and non-zero access password backscatter alarm code ready arbitrate, reply, acknowledged eas-bit is set and non-zero access password ? arbitrate open eas-bit is set and non-zero access password open secured eas-bit is set and non-zero access password secured killed eas-bit is set and non-zero access password ? killed
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 44 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 15.12.5 calibrate after execution of the custom calibrate command the g2x will continuously backscatter the user memory content in an infinite loop. the g2xl will co ntinuously backsca tter zeros. this command can be used for frequency spectrum measurements. calibrate can only be executed from the secure state with an non-zero access password set otherwise the command will be ignored. the calibrate command includes a crc-16 calculated over the whole command, the handle and a prepended frame-sync. [1] g2xm [2] g2xl table 29. calibrate command command rn16 crc-16 # of bits 16 16 16 description 11100000 00000101 handle - table 30. g2x reply to a successful calibrate command header infinite repeat # of bits 1 512 (looped) description 0 user memory data [1] zeros [2] table 31. calibrate command-response table starting state condition response next state ready all ? ready arbitrate, reply, acknowledged all ? arbitrate secured nonzero access password backscatter infinite _ access password is zero ? secured killed all ? killed
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 45 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 16. support information 16.1 crc calculation example old rn = 3d5bh table 32. practical example of crc calculation for a 'req_rn' command by the reader crc calculated @ reader cmd code for req_rn ffff 1fffe 1fffc 0efd9 0cf93 08f07 00e2f 01c5e 1 2899 first byte of rn 0513a 0a274 144e8 199f1 133e2 177e5 0efca 1 df9 4 second byte of rn 0af09 15e12 0bc24 17848 1e0b1 0d143 1a286 1 450c -> ones complement: baf 3 => command-sequence: c1 3d 5b ba f3 hex
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 46 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl table 33. practical example of crc calculation for a 'req_rn' command by the reader crc calculated @ tag cmd code for req_rn ffff 1fffe 1fffc 0efd9 0cf93 08f07 00e2f 01c5e 1 2899 first byte of rn 0513a 0a274 144e8 199f1 133e2 177e5 0efca 1 df9 4 second byte of rn 0af09 15e12 0bc24 17848 1e0b1 0d143 1a286 1 450c first byte of crc 19a39 02453 15887 1a12f 1425e 084bc 10978 0 12f0 second byte of crc 135c1 17ba3 1e767 1cece 08dbd 00b5b 10697 1 1d0f -> residue ok
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 47 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 17. abbreviations table 34. abbreviations acronym description crc cyclic redundancy check cw continuos wave eeprom electrically erasable pr ogrammable re ad only memory epc electronic product code (containing header, domain manager, object class and serial number) fcs flip chip strap fm0 bi phase space modulation g2 generation 2 hbm human body model ic integrated circuit lsb least significant byte/bit msb most significant byte/bit nrz non-return to zero coding rf radio frequency rtf reader talks first tari type a reference interval (iso 18000-6) uhf ultra high frequency x xb value in binary notation xx hex value in hexadecimal notation
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 48 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 18. references [1] epcglobal: epc radio-frequency identity protocols class-1 generation-2 uhf rfid protocol for communications at 860 mhz ? 960 mhz, version 1.1.0 (december 17, 2005) [2] epcglobal: epc tag data standards [3] epcglobal (2004): fmcg rfid phys ical requirements document (draft) [4] epcglobal (2004): class-1 generation-2 uhf rfid implementation reference (draft) [5] european telecommunications standards institute (etsi), en 302 208: electromagnetic compatibility and radio spectrum matter s (erm) ? radio-frequency identification equipment operating in the band 865 mhz to 868 mhz with power levels up to 2 w, part 1 ? technical characteristics and test methods [6] european telecommunications standards institute (etsi), en 302 208: electromagnetic compatibility and radio spectrum matter s (erm) ? radio-frequency identification equipment operating in the band 865 mhz to 868 mhz with power levels up to 2 w, part 2 ? harmonized en under article 3.2 of the r&tte directive [7] [cept1]: cept rec 70-03 annex 1 [8] [etsi1]: etsi en 330 220-1, 2 [9] [etsi3]: etsi en 302 208-1, 2 v<1.1. 1> (2004-09-electrom agnetic compatibility and radio spectrum matters (erm) radio frequency identification equipment operating in the band 865 - mhz to 868 mhz with power levels up to 2 w part 1: technical characteristics and test methods. [10] [fcc1]: fcc 47 part 15 section 247 [11] iso/iec directives, part 2: rules for th e structure and drafting of international standards [12] iso/iec 3309: information technology ? telecommunications and information exchange between systems ? high-level data link control (hdlc) procedures ? frame structure [13] iso/iec 15961: information technology, automatic identification and data capture ? radio frequency identification (rfid) for item management ? data protocol: application interface [14] iso/iec 15962: information technology, automatic identification and data capture techniques ? radio frequency identification (rfid) for item management ? data protocol: data encoding rules and logical memory functions [15] iso/iec 15963: information technology ? radio frequency identification for item management ? unique identification for rf tags [16] iso/iec 18000-1: information technology ? radio frequency identification for item management ? part 1: reference architecture and definition of parameters to be standardized [17] iso/iec 18000-6: information technology automatic identification and data capture techniques ? radio frequency identification for item management air interface ? part 6: parameters for air interface communications at 860?960 mhz [18] iso/iec 19762: information technology aidc techniques ? harmonized vocabulary ? part 3: radio-frequency identification (rfid)
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 49 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl [19] u.s. code of federa l regulations (cfr), title 47, chapter i, part 15: radio-frequency devices, u.s. federal communications commission. [20] data sheet - delivery type description ? gene ral specification for 8? wafer on uv-tape with electronic fail die marking, bl-id document number: 1093** 1 [21] data sheet - flip chip strap - fcs2, general pa cking specification, bl-id document number: 1738** 1. ** ... document version number
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 50 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 19. revision history table 35. revision history document id release date data sheet status change notice supersedes 139036 20110310 product data sheet 139035 modifications: ? table 5 ? tssop8 m arking ? : added ? section 15.1.1.2 ? special behavior of user memory address 1fh ? : added 139035 20091102 product data sheet 139034 modifications: ? type sot1122 added ? figure 2 ? wafer layout and pinning information ? : correction of drawing 139034 20090721 product data sheet 139033 modifications: ? ta b l e 11 ? tssop8 characteristics ? and table 12 ? package interface characteristics ? :removed ?memory characteristics? 139033 20090605 product data sheet - 139032 139132 modifications: ? this data sheet is a combination of data sheets sl3ics1002 and sl3ics1202 ? new type fcs2 aluminum, sot1040ab2 added ? section 8.1.6 ? fail die identification ? : added ? section 12 ? packing information ? : edited 139032 20080716 product data sheet 139031 modifications: ? rephrasing of section 2 ? features and benefits ? on page 2 ? added ?calibrate command? in section 2 ? features and benefits ? on page 2 ? redesign of figure 1 ? block diagram of g2x ic ? on page 4 ? merging of fig. 2 pinning and fig. 3 wafer layout - see figure 2 ? wafer layout and pinning information ? on page 5 ? added type ?fcs2 polymer strap - sot1040aa1? in section 4 ? ordering information ? , section 6 ? wafer layout and pinning information ? , section 7 ? package outline ? , section 8 ? mechanical specification ? , section 9 ? limiting values ? , section 10 ? characteristics ? ? added section 11 ? handling information for flip chip strap (fcs2, sot1040) ? on page 19 ? added section 12 ? packing information ? on page 20 ? added table 13 ? symbol description ? on page 22 ? correction of table 16 ? memory map ? on page 30 ? removed ?ongoing? in 32 bit ongoing in section 2.1 and table 15 ? g2x memory sections ? 139031 20080428 product data sheet 139030
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 51 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl modifications: ? update of table 1 ?ordering information? on page 3 ? added section 7 ? package outline ? on page 7 ? added section 8.1.7 ? map file distribution ? on page 15 ? added table 9 ?limiting values tssop8 [1][2] ? on page 14 ? added room temperature in table 11 ?memory characteristics? on page 15 ? added section 10.2 ? tssop8 characteristics ? on page 17 ? update of the ? epcglobal compliance an d interoperability ce rtification? in section 13.4 ? air interface standards ? on page 23 ? correction of ?(excluding 16 bit crc-16 and 16 bit pc) in table 15 ? g2x memory sections ? on page 29 ? correction of initials in ?tag mask designer? in table 16 ? memory map ? on page 30 ? removed the sentence ?the chan geeas custom command will toggl e the state of the eas-alarm bit located in the eeprom? in section 15.12.3 ? changeeas ? on page 40 . ? added description of changeeas in table 23 ? changeeas command ? on page 40 139030 20071221 product data sheet - 139011 modifications: ? change of product status ? general update 139011 20070910 objective data sheet - 139010 modifications: ? removed double section change eas, eas alarm, chapter 12.11.7 ? changed ?reader? to ?tag? 139010 20070612 objective data sheet - - ? initial version table 35. revision history ?continued document id release date data sheet status change notice supersedes
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 52 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 20. legal information 20.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 20.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? 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stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 53 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 20.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. ucode ? is a trademark of nxp b.v. 21. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 54 of 56 nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 22. tables table 1. ordering information g2xm . . . . . . . . . . . . . . . .3 table 2. ordering information g2xl. . . . . . . . . . . . . . . . .3 table 3. pin description of sot1040-1 . . . . . . . . . . . . . .6 table 4. pin description of tssop8 . . . . . . . . . . . . . . . . .7 table 5. tssop8 marking . . . . . . . . . . . . . . . . . . . . . . . .8 table 6. pin description of sot1122 . . . . . . . . . . . . . . .10 table 7. sot1122 marking. . . . . . . . . . . . . . . . . . . . . . .10 table 8. mechanical properties sot1040aa1 . . . . . . . .16 table 9. mechanical properties sot1040ab2 . . . . . . . .16 table 10. limiting values [1][2] . . . . . . . . . . . . . . . . . . . . . .17 table 11. wafer characteristics . . . . . . . . . . . . . . . . . . . .18 table 12. package interface charac teristics . . . . . . . . . . .18 table 13. symbol description . . . . . . . . . . . . . . . . . . . . . .22 table 14. operating distances for ucode g2x based tags and labels in released frequency bands . .22 table 15. g2x memory sections . . . . . . . . . . . . . . . . . . .29 table 16. memory map. . . . . . . . . . . . . . . . . . . . . . . . . . .30 table 17. readprotect command . . . . . . . . . . . . . . . . . . .36 table 18. g2x reply to a successful readprotect procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 table 19. readprotect command-response table . . . . . .37 table 20. reset readprotect comma nd . . . . . . . . . . . . .39 table 21. g2x reply to a successful reset readprotect command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 table 22. reset readprotect command-response table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 table 23. changeeas command . . . . . . . . . . . . . . . . . . 40 table 24. g2x reply to a successful changeeas command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 table 25. changeeas command-response table . . . . . . 41 table 26. eas_alarm command . . . . . . . . . . . . . . . . . . . 42 table 27. g2x reply to a successful eas_alarm command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 table 28. eas_alarm command-response table . . . . . . . 43 table 29. calibrate command . . . . . . . . . . . . . . . . . . . . . 44 table 30. g2x reply to a successful calibrate command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 table 31. calibrate command-response table . . . . . . . . . 44 table 32. practical example of crc calculation for a 'req_rn' command by the reader . . . . . . . . . 45 table 33. practical example of crc calculation for a 'req_rn' command by the reader . . . . . . . . . . 46 table 34. abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 47 table 35. revision history . . . . . . . . . . . . . . . . . . . . . . . . 50 23. figures fig 1. block diagram of g2x ic . . . . . . . . . . . . . . . . . . . .4 fig 2. wafer layout and pinning information . . . . . . . . . .5 fig 3. pinning - sot1040-1 . . . . . . . . . . . . . . . . . . . . . . .6 fig 4. package tssop8, sot505-1 . . . . . . . . . . . . . . . .7 fig 5. package outline sot1122 . . . . . . . . . . . . . . . . . . .9 fig 6. package fcs2, sot1040aa1, 12 mm cu metallization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 fig 7. package fcs2, sot1040ab2, 20 mm al metallization . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 fig 8. splicing drawing sot1040-1 . . . . . . . . . . . . . . . .13 fig 9. g2x tid memory structure . . . . . . . . . . . . . . . . .29
139036 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet company public rev. 3.6 ? 10 march 2011 139036 55 of 56 continued >> nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl 24. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 2 2.1 key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.3 custom commands. . . . . . . . . . . . . . . . . . . . . . 2 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 ordering information . . . . . . . . . . . . . . . . . . . . . 3 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 wafer layout and pinning information . . . . . . . 5 6.1 wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.2 fcs2 layout strap and pinning . . . . . . . . . . . . . 6 7 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 8 mechanical specification . . . . . . . . . . . . . . . . 14 8.1 wafer specification . . . . . . . . . . . . . . . . . . . . . 14 8.1.1 wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 8.1.2 wafer backside . . . . . . . . . . . . . . . . . . . . . . . . 14 8.1.3 chip dimensions . . . . . . . . . . . . . . . . . . . . . . . 14 8.1.4 passivation on front . . . . . . . . . . . . . . . . . . . . 14 8.1.5 au bump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 8.1.6 fail die identification . . . . . . . . . . . . . . . . . . . 15 8.1.7 map file distribution. . . . . . . . . . . . . . . . . . . . . 15 8.2 sot1040 specification . . . . . . . . . . . . . . . . . . 16 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17 10 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 18 10.1 wafer characteristics . . . . . . . . . . . . . . . . . . . 18 10.2 package characteristics . . . . . . . . . . . . . . . . . 18 11 handling information for flip chip strap (fcs2, sot1040) . . . . . . . . . . . . . . . . . . . . . . . 19 11.1 storage conditions . . . . . . . . . . . . . . . . . . . . . 19 11.2 assembly conditions . . . . . . . . . . . . . . . . . . . . 19 11.2.1 general assembly recommendations . . . . . . . 19 11.2.2 antenna bonding . . . . . . . . . . . . . . . . . . . . . . 19 11.2.3 label converting . . . . . . . . . . . . . . . . . . . . . . . 19 12 packing information . . . . . . . . . . . . . . . . . . . . 20 12.1 flip chip strap (fcs2, sot1040) . . . . . . . . . 20 12.2 wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 12.3 tssop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 12.4 sot1122 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 13 functional description . . . . . . . . . . . . . . . . . . 21 13.1 power transfer . . . . . . . . . . . . . . . . . . . . . . . . 21 13.2 data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . 21 13.2.1 reader to g2x link . . . . . . . . . . . . . . . . . . . . 21 13.2.2 g2x to reader link . . . . . . . . . . . . . . . . . . . . . 21 13.3 operating distances . . . . . . . . . . . . . . . . . . . . 22 13.4 air interface standards . . . . . . . . . . . . . . . . . . 23 14 physical layer and signaling . . . . . . . . . . . . . 24 14.1 reader to g2x communication . . . . . . . . . . . 24 14.1.1 physical layer. . . . . . . . . . . . . . . . . . . . . . . . . 24 14.1.2 modulation . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 14.1.3 data encoding . . . . . . . . . . . . . . . . . . . . . . . . 24 14.1.4 data rates . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 14.1.5 rf envelope for r=>t . . . . . . . . . . . . . . . . . . 24 14.1.6 interrogator power-up/do wn waveform . . . . . 24 14.1.7 preamble and frame-sync . . . . . . . . . . . . . . . 24 14.2 g2x to reader communication . . . . . . . . . . . . 25 14.2.1 modulation . . . . . . . . . . . . . . . . . . . . . . . . . . 25 14.2.2 data encoding . . . . . . . . . . . . . . . . . . . . . . . . 25 14.2.2.1 fm0 baseband . . . . . . . . . . . . . . . . . . . . . . . . 25 14.2.2.2 fm0 preamble . . . . . . . . . . . . . . . . . . . . . . . . 25 14.2.2.3 miller-modulated sub carri er . . . . . . . . . . . . . 25 14.2.2.4 miller sub carrier preamble . . . . . . . . . . . . . . 25 14.2.3 data rates . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 14.3 link timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 14.3.1 regeneration time . . . . . . . . . . . . . . . . . . . . . 26 14.3.2 start-up time. . . . . . . . . . . . . . . . . . . . . . . . . . 26 14.3.3 persistence time . . . . . . . . . . . . . . . . . . . . . . 26 14.4 bit and byte ordering . . . . . . . . . . . . . . . . . . . 26 14.5 data integrity . . . . . . . . . . . . . . . . . . . . . . . . . 27 14.6 crc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 15 tag selection, inventory and access . . . . . . 28 15.1 g2x memory . . . . . . . . . . . . . . . . . . . . . . . . . 29 15.1.1 memory map . . . . . . . . . . . . . . . . . . . . . . . . . 30 15.1.1.1 user memory (only g2xm ) . . . . . . . . . . . . . . 31 15.1.1.2 special behavior of user memory address 1fh 31 15.1.1.3 supported epc types . . . . . . . . . . . . . . . . . . 31 15.2 sessions, selected and inventoried flags. . . . 32 15.2.1 g2x states and slot counter . . . . . . . . . . . . . 32 15.2.2 g2x state diagram . . . . . . . . . . . . . . . . . . . . 32 15.3 managing tag populations . . . . . . . . . . . . . . . 32 15.4 selecting tag populations. . . . . . . . . . . . . . . . 32 15.5 inventorying tag populations . . . . . . . . . . . . . 32 15.6 accessing individual tags . . . . . . . . . . . . . . . . 32 15.7 interrogator co mmands and tag replies . . . . . 32 15.7.1 commands. . . . . . . . . . . . . . . . . . . . . . . . . . . 32 15.7.2 state transition tables. . . . . . . . . . . . . . . . . . . 33 15.7.3 command response tables . . . . . . . . . . . . . . 33 15.7.4 example data-flow exchange . . . . . . . . . . . . . 33 15.8 mandatory select commands . . . . . . . . . . . . 33 15.8.1 select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 15.9 mandatory inventory commands. . . . . . . . . . 34 15.9.1 query . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 15.9.2 queryadjust . . . . . . . . . . . . . . . . . . . . . . . . . . 34 15.9.3 queryrep. . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
nxp semiconductors sl3ics1002/1202 ucode g2xm and g2xl ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 10 march 2011 139036 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 15.9.4 ack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 15.9.5 nak . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 15.10 mandatory access commands. . . . . . . . . . . . 35 15.10.1 req_rn. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 15.10.2 read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 15.10.3 write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 15.10.4 kill . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 15.10.5 lock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 15.11 optional access command . . . . . . . . . . . . . . 35 15.11.1 access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 15.12 custom commands . . . . . . . . . . . . . . . . . . . . 36 15.12.1 readprotect . . . . . . . . . . . . . . . . . . . . . . . . . . 36 15.12.2 reset readprotect . . . . . . . . . . . . . . . . . . . . . 38 15.12.3 changeeas . . . . . . . . . . . . . . . . . . . . . . . . . . 40 15.12.4 eas_alarm . . . . . . . . . . . . . . . . . . . . . . . . . . 42 15.12.5 calibrate . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 16 support information . . . . . . . . . . . . . . . . . . . . 45 16.1 crc calculati on example . . . . . . . . . . . . . . 45 17 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 47 18 references . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 19 revision history . . . . . . . . . . . . . . . . . . . . . . . . 50 20 legal information. . . . . . . . . . . . . . . . . . . . . . . 52 20.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 52 20.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 20.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 20.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 53 21 contact information. . . . . . . . . . . . . . . . . . . . . 53 22 tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 23 figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 24 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

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